Jeehwan Kim

Jeehwan Kim is an associate professor in MIT’s Department of Materials Science and Engineering and Department of Mechanical Engineering. His research focuses on innovation in nanotechnology for electronic, photonic, and energy applications. His group is currently developing a single-crystalline-based memristors for neuromorphic computing and graphene-based layer transfer technology which substantially reduces the cost of expensive wafers. The group’s focus is on developing hardware for efficient neuromorphic computing and fabricating high-performance devices with low manufacturing cost based on this graphene-based layer transfer technique. Based on their expertise in the materials innovation, Kim’s group develops large scale neuromorphic computing arrays and extremely flexible inorganic electronic/photonic devices. Kim earned a BS from Hongik University, an MS from Seoul National University, and a PhD from University of California, Los Angeles, all in materials science and engineering.

Publications

• Kum, H. S., Lee, H., Kim, S., Lindemann, S., Kong, W., Qiao, K., Chen, P., Irwin, J., Lee, J. H., Xie, S., Subramanian, S., Shim, J., Bae, S.-H., Choi, C., Ranno, L., Seo, S., Lee, S., Bauer, J., Li, H., Lee, K., Robinson, J. A., Ross, C. A., Schlom, D. G.,  Rzchowski, M. S., Eom, C.-B., Kim, J. (2020). Heterogeneous integration of singlecrystalline complex-oxide membranes. Nature, Vol 578, 75-81.
• Shim, J., Bae, S-H., Kong, W., Lee, D., Qiao, K., Nezich, D., Park, Y. J., Zhao, R., Sundaram, S., Li, X., Yeon, H., Choi, C., Kum, H., Yue, R., Zhou, G., Ou, Y., Lee, K., Moodera, J., Zhao, X., Ahn, J-H., Hinkle, C., Ougazzaden, A., Kim, J. (2018). Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials. Science, 362, 665 (2018).
• Choi, S., Tan, S., Li, Z., Kim, Y., Choi, C., Chen, P-Y., Yeon, H., Yu, S., Kim, J. (2018). SiGe epitaxial memory for neuromorphic computing with reproducible high performance based on engineered dislocations. Nature Materials 17, 335.
• Kim, Y., Cruz, S.S., Lee, K., Alawode, B.O., Choi, C., Song, Y., Johnson, J.M., Heidelberger, C., Kong, W., Choi, S., Qiao, K., Almansouri, I., Fitzgerald, E.A., Kong, J., Kolpak, A.M., Hwang, J., Kim, J. (2017). Remote epitaxy through graphene enables two-dimensional material-based layer transfer. Nature, Vol. 544, 340.
• Kim, J., Park, H., Hannon, J.B., Bedell, S.W., Fogel, K., Sadana, D.K., Dimitrakopoulos, D. (2013). Layer-Resolved Graphene Transfer via Engineered Strain Layers. Science, Vol. 342, 6160, 833.

Media

• February 5, 2020: MIT News, Engineers mix and match materials to make new stretchy electronics.
• October 11, 2018: MIT News, Researchers quickly harvest 2-D materials, bringing them closer to commercialization.
• October 8, 2018: CNBC, MIT researchers develop new chip design to take us closer to computers that work like human brains.
• October 8, 2018: MIT News, Study opens route to flexible electronics made from exotic materials.
• January 22, 2018: MIT News, Engineers design artificial synapse for “brain-on-a-chip” hardware.