Ruonan Han

Ruonan Han is a professor in the Department of Electrical Engineering and Computer Science (EECS) and a member of the Microsystems Technology Laboratories (MTL) at MIT. Han aims to explore microelectronic circuits and systems to bridge the terahertz gap between microwave and infrared domains. The Han lab focuses on challenging topics such as high-power generation, sensitive detection and energy-efficient systems. Han received a PhD in electrical and computer engineering from Cornell University, an MS in electrical engineering from the University of Florida, and a BS in microelectronics from Fudan University, China.

Selected Publications

• Yadav, P., Wang, J., Baig, D. A., Pastrana-Gonzalez, J., Niroula, J., Darmawi-Isakandar, P., Rohde, U. L., Islam, A., Bakir, M., Han, R., & Palacios, T. (2025). 3D-millimeter wave integrated circuit (3D-mmWIC): A gold-free 3D-integration platform for scaled RF GaN-on-Si dielets with Intel 16 Si CMOS. In Proceedings of the 2025 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (pp. 327–330).
• Jia, M., Xie, H., Chang, H., Zhang, Q., Han, R., & Palacios, T. (2025). A fully integrated 263-GHz retro-backscatter circuit with 105°/82° reading angle and 12-dB conversion loss. In Proceedings of the 2025 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (pp. 367–370).
• Wang, J., Harris, I., Ibrahim, M., Englund, D., & Han, R. (2025). A wireless terahertz cryogenic interconnect that minimizes heat-to-information transfer. Nature Electronics, 8, 426–436.

Media

• June 18, 2025: MIT News, New 3D chips could make electronics faster and more energy-efficient
• February 20, 2025: MIT News, Chip-based system for terahertz waves could enable more efficient, sensitive electronics
• May 29, 2024: MIT News, Modular, scalable hardware architecture for a quantum computer